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|| Keynote Speeches || Invited Talks || 議程表|| Technical Program||
將近半個世紀以來，半導體製程技術在摩爾定律經驗法則的規範之下，元件尺寸已經一路來到22奈米的技術層面。 隨著元件尺寸的微縮，各式消費性電子產品莫不往輕、小、短、薄且低功耗方向發展。產品功能性也擴及文字圖片展示到動態即時語音影片的播放。為滿足多工需求，結合各式單一功能硬體並搭配韌體開發已成為趨勢。確保新系統的性能並降低製造成本將是SoC的重大挑戰。 雲端時代的成熟仰賴伺服器端之高速電腦運算以及背後龐大資料庫的管理。使用者端持有低功耗，多功能的連結系統(智慧型手機，電腦)成為必要條件。伺服器端的難處落在資料庫擷取與傳輸的速度，而使用者端則是期盼高續航力。以相變化記憶體為新元素所組成的SoC將可提供兩者的解決方案。SoC在雲端世代將扮演重要的角色。
◎ 吳敏求董事長簡介
學歷：
經歷：旺宏電子的創辦人及現任董事長兼總經理 專長領域：半導體產業、企業執行管理 榮譽：
其他資訊：吳董事長目前62歲，已婚並育有二個小孩。 In 2008, Tom Friedman, the author of “The world is hot, flat and crowded”, depicted the critical environmental and energy issues facing our earth. He also introduced the concept of Smart Power Grid or Energy Internet for our future society. Today, the importance of energy saving and carbon dioxide emission reduction has been universally recognized. Due to the tremendous amount of business opportunities, more and more companies are developing green energy products, including solar power, LED lighting, electric cars/hybrid cars, wind power, battery, fuel cell, super capacitors, etc. Governments are implementing various policies to facilitate the growth for alternative energy. Investors give energy related investments higher priority. Even though a smart grid system is huge and complex, the whole world is moving toward that concept, quickly. This presentation will first introduce some of the opportunities and challenges facing green energy designs. Very easily, audience will notice that the green energy industry is chaotic or it is still in its early stage. Options of technology approaches and business models are plenty. Green energy products require various types of IC chips. Green engineering could provide $60B to $70B in new semiconductor annual demand, according to a marketing research report. This presentation will explain why Taiwan semiconductor industry should focus on analog/mixed signal IC products and grab the green energy opportunities. It will also discuss Taiwan's strength and weakness in the foundry and fabless design sectors.
◎ 胡國強董事長簡介
學歷：
經歷：
Where Taiwan Stands in Facing 3D-IC Challenges and Opportunities?
SoC design is facing relentless demand for higher bandwidth, lower power, smaller form factor and more function integration. The traditional solution depends on CMOS scaling based on Moore’s law is becoming a daunting effort as device feature shrinks beyond 40nm. 3D Packaging with TSV interconnects provides another possible path to meet the demands mentioned above. Even though 3D Packaging with wire-bond stacked chips has already been widely used in the SoC industry, there are many challenges like IO standardization, thermal management, testability, reliability, proper EDA tools, business infrastructure and supply chain management plagued the more advanced TSV interconnect scheme. This talk will address how Taiwan can leverage the chip design and manufacturing infrastructure and the experience learned from 3D Packaging with wire-bond stacked chips to expedite solutions for the hurdles aforementioned.
◎ 賴俊豪總經理簡介
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◎ 王駿發教授簡介
Prof. Jhing-fa Wang is currently a Chair & Distinguished Professor in the Department of Electrical Engineering, National Cheng Kung University (NCKU). He got his bachelor and master degree from NCKU in Taiwan and Ph. D. from Stevens Institute of Technology USA in 1973, 1979 and 1983 respectively. He is the formal chair of IEEE Tainan Section & now the Coordinator of Industrial Liaison Committee Region 10, IEEE. He was elected as IEEE Fellow in 1999 for his contribution on: “Hardware and Software Co-design on Speech Signal Processing”. He received Outstanding Research Awards and Outstanding Researcher Award from National Science Council in 1990, 1995, 1997, and 2006 respectively. He also received Outstanding Industrial Awards from ACER and Institute of Information Industry and the Outstanding Professor Award from Chinese Engineer Association, Taiwan in 1991 and 1996 respectively. He also received the culture service award from Ministry of Education, Taiwan in 2008 and Distinguished Scholar Award of KT Li from NCKU in 2009. Prof. Wang was also invited to give the Keynote Speeches in PACLIC 12 in Singapore, 1998, UWN 2005 in Taipei, WirlessCom 2005 in Hawaii,IIH-MSP2006 in Pasadena,USA , ISM2007 in Taichung and PCM 2008 in Tainan respectively. He also served as an associate editor on IEEE Transactions on Neural Network and IEEE Transactions on VLSI System and Editor in Chief on International Journal of Chinese Engineering from 1995 to 2000. Prof. Wang’s research areas are on multimedia signal processing including speech signal processing, image processing, and VLSI system design. Concerning about the publication, he has published about one hundred journal papers on IEEE, SIAM, IEICE, IEE and about two hundreds international conference papers.
Location Based Vital Monitoring System for Step Down Ward
◎ 盧智成總經理簡介
學歷：
經歷：
專利：
醫療電子產業與國民健康息息相關，是一種協助人類疾病預防、診斷、減緩與治療的民生必需工業，因此較不會因景氣變化而造成整體醫療電子產業有大幅度的波動。隨著高齡社會來臨，帶來許多醫療照護與保健領域的需求，預期也將促動市場快速成長。在未來的十年中，各國政府投入龐大的醫療預算將對財政支出造成的沉重負擔，因此在維持基本醫療品質的考量，但又希望降低醫療支出的情形下，醫療器材的發展必將朝向高性價比、低耗能、小型化、遠距照護、智慧型簡易操作等方向發展。近年我國醫療電子產業產值與出口均呈現停滯現像，急需選擇符合我國資通訊產業發展利基之產品切入。本演講將針對半導體全球現況與趨勢、台灣半導體現況與未來挑戰、全球醫療電子產品發展趨勢、台灣醫療電子產業現況與我國醫療電子產業契機逐一探討說明，希望我國資通訊產業研發與製造優勢觸角能延伸至醫療器材開發，建置高性價比之醫療器材產業，促進人民健康福祉。
◎ 邱俊誠教授簡介
學歷：美國科羅拉多大學 航太工程學系 博士 經歷：
專長領域：微機電系統、生醫感測晶片設計與應用、系統整合、伺服控制系統 榮譽：
邱俊誠教授在醫療電子、微機電系統與光機電整合領域已有多年經驗與成果，曾擔任交通大學電機與控制工程學系主任、國科會中區微機電中心副主任與交通大學智慧型仿生系統研究中心主任，現任中醫大生醫研發中心主任兼附設醫院資訊副院長及晶片系統國家型科技計畫專案召集人，負責建立醫療電子系統平台與規劃國科會、經濟部與教育部生醫系統晶片之研發方向。在過去十多年之研究生涯當中，邱教授曾獲得二十五項獎勵。為表彰邱教授的學術成就與貢獻，於2009年(98)榮膺中國工程師學會『傑出工程教授』榮譽，並於總統府獲馬英九總統召見。在生醫電子研究方面，邱教授曾經帶領研究生研發『無線長時監控型十二導程心電圖』，榮獲由國家生技醫療產業策進會所主辦，為鼓勵生技產業創新研發所舉辦之『國家新創獎』2007年第一名殊榮。近五年內邱教授已獲得五項中華民國專利與二項美國專利(其中已有三項專利成功技術轉移至產業界)，並在國際知名頂尖工程期刊等發表近35篇期刊論文。
3D Video and Graphics for Biomedical Applications 3D video and graphics have been widely used in various biomedical applications to make complex medical procedures and biological functions easier to understand. Medical visualization and 3D informatics provide surgeons and developmental biologists necessary spatial relationships for diagnosing and navigating a human condition. Biomedical applications require a higher resolution and quality and is often more sophisticated and complex. Every process in a 3D medical informatics pipeline has the potential for interactive feedback and display of multidimensional data. The advance in gaming, 3D data acquisition, display hardware technologies and network infrastructure have lowered the cost barrier and will likely spur another wave of 3D development of biomedical applications. New applications shall take advantage of the latest technological advancements to create, deliver, and display 3D contents with smarter interactive feedback. To gain market acceptance, they need to be affordable and reduce the 3D drawbacks to a minimum. Good blending of 2D and 3D technologies with text, image space, and vector space solutions is necessary for creating affordable and intuitive contents that users can use and interact with. Simulation techniques such as Finite Element Analysis can open the door to advanced diagnostic analysis of patient specific 3D datasets.
◎ 貢世元博士簡介
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專長領域：3D numerical simulation, Stochastic Processes, 3D modeling & user interface 榮譽：
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